Semi-conductor module with an encapsulating cement mass that covers a semi-conductor component
US10685894B2 · kind B2 · utility
2Cited by
3References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 14, 2014 |
| Grant date | Jun 16, 2020 |
| Priority date | — |
| Expiry date | Oct 14, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semi-conductor module with an encapsulating mass that covers a semi-conductor component, in which the encapsulating mass is cement.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.