Semiconductor device package including a wall and a grounding ring exposed from the wall
US10689249B2 · kind B2 · utility
1Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2015 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Sep 16, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A semiconductor device package includes a carrier, a wall disposed on a top surface of the carrier, a cover, and a sensor element. The cover includes a portion protruding from a bottom surface of the cover, where the protruding portion of the cover contacts a top surface of the wall to define a space. The sensor element is positioned in the space.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.