Patent · US Active

Control of current density in an electroplating apparatus

US10689774B2 · kind B2 · utility

1Cited by

83References

13Claims

0Family size

Assignee

Lam Research Corporation · US

Inventors

Zhian He · Beaverton, US
Ashwin Ramesh · Bengaluru, IN
Shantinath Ghongadi · Tigard, US

Key dates

Filing date	Jan 10, 2019
Grant date	Jun 23, 2020
Priority date	—
Expiry date	Jan 10, 2039

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25D21/12
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

Various embodiments herein relate to methods and apparatus for electroplating metal onto substrates. In various cases, a reference electrode may be modified to promote improved electroplating results. The modifications may relate to one or more of the reference electrode's shape, position, relative conductivity compared to the electrolyte, or other design feature. In some particular examples the reference electrode may be dynamically changeable, for example having a changeable shape and/or position. In a particular example the reference electrode may be made of multiple segments. The techniques described herein may be combined as desired for individual applications.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.