Apparatus for dispensing liquid material and method for fabricating semiconductor device
US10691020B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2019 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Jun 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present disclosure provides an apparatus for dispensing liquid material, including a dispensing arm, a wafer holder against the dispensing arm, a first nozzle on the dispensing arm, a first distance laterally spacing the first nozzle and a center of the wafer holder, and a first height vertically spacing the first nozzle and a surface of the wafer holder, and a second nozzle on the dispensing arm, a second distance laterally spacing the second nozzle and the center of the wafer holder, and a second height vertically spacing the second nozzle and the surface of the wafer holder, wherein the second distance is greater than the first distance, and the first height is greater than the second height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.