Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film
US10692820B2 · kind B2 · utility
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3References
14Claims
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Key dates
| Filing date | Nov 21, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Nov 21, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/18
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A hybrid composite film, a method of fabricating the hybrid composite film, and an integrated circuit device including the hybrid composite film, the hybrid composite film including a polymer film; and a plurality of organic-inorganic composite particles dispersed in the polymer film, wherein each particle of the plurality of organic-inorganic composite particles includes an inorganic particle and an organic capping layer surrounding the inorganic particle, the organic capping layer having a hydroxyl group-terminated end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.