Jun-Won Han
4Patents
1h-index
18Co-inventors
37Inventor score
Filing activity: Jan 3, 2014 → Nov 21, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9076701B2 | Wafer supporting structure, intermediate structure of a semiconductor package including the wafer supporting structure | Emerging Cross-Sectional Technologies | 2 | Active |
| US10692820B2 | Hybrid composite film, method of fabricating the same, and integrated circuit device including hybrid composite film | Electricity | 0 | Active |
| US9627205B2 | Method of manufacturing a semiconductor device using purified block copolymers and semiconductor devices | Electricity | 0 | Active |
| US9458365B2 | Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.