Semiconductor chip and method for producing a semiconductor chip
US10693033B2 · kind B2 · utility
0Cited by
7References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 25, 2019 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Jun 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/825
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor chip (100) is provided, having a first semiconductor layer (1), which has a lateral variation of a material composition along at least one direction of extent. Additionally provided is a method for producing a semiconductor chip (100).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.