Solenoid structure with conductive pillar technology
US10693432B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2018 |
| Grant date | Jun 23, 2020 |
| Priority date | — |
| Expiry date | Nov 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2001/005
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three-dimensional (3D) solenoid structure includes a first inductor portion having a first surface and a second surface opposite the first surface. The 3D solenoid structure further includes a first capacitor portion, a first inductor pillar, at least one capacitor pillar, a second inductor portion, a second inductor pillar and a first inductor bonding interface. The first inductor pillar is coupled to the first surface of the first inductor portion. The capacitor pillar(s) is coupled to the first capacitor portion. The second inductor portion includes a first surface and a second surface opposite the first surface. The second inductor pillar is coupled to the first surface of the second inductor portion. The first inductor bonding interface, between the first inductor pillar and the second inductor pillar, couples together the first inductor portion and the second inductor portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.