Transducer packaging
US10696545B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 13, 2018 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jun 13, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The application describes a package for a MEMS transducer. The package has a package substrate having an acoustic port formed in the package substrate. The acoustic port comprises a first acoustic port volume portion and a second acoustic port volume portion, the first acoustic port volume portion being separated from the second acoustic port volume potion by a discontinuity in a sidewall of the substrate. The cross sectional area of the first acoustic port volume portion is greater than the cross sectional area of the second acoustic port volume portion. A barrier may be attached to the upper surface of the package substrate so as to seal or cover the acoustic port.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.