Adhesive with tunable porosity and methods to support temporary bonding applications
US10696874B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Jan 24, 2019 |
| Grant date | Jun 30, 2020 |
| Priority date | — |
| Expiry date | Jan 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68381
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Methods and compositions are described for a temporary adhesive used to affix a work unit onto a carrier substrate whereby its porosity is tuned by choosing and adjusting the polymeric resin and filler components to provide sufficient adhesion to support a manufacturing process, and upon completion, there is advanced penetration of a liquid into the interfacial bond causing release of the work unit without harm. The temporary adhesive provides a tunable porosity that is dependent upon the mathematical calculation of the weight basis ratio of filler to binder, that is preferably greater than 1.0, more preferably greater than 2.0, and most preferably greater than 3.0. The temporary adhesive may be applied and cured in a variety of ways that meet the needs of the form of the work unit and objectives of the manufacturing process. The invention provides benefits of flexibility and reduced cost when establishing practices to handle difficult work units in the manufacture of semiconductors and flat panel displays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.