Patent · US Active

Semiconductor chip with fracture detection

US10705132B2 · kind B2 · utility

0Cited by

5References

20Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thomas Zettler · Hersbruck, DE
Dirk Hammerschmidt · Villach, AT
Friedrich Rasbornig · Klagenfurt, AT
Wolfgang Scheibenzuber · Munich, DE
Hans-Joerg Wagner · Villach, AT

Key dates

Filing date	Mar 1, 2019
Grant date	Jul 7, 2020
Priority date	—
Expiry date	Mar 1, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A method including feeding a test signal into a first end of a conductor track of a semiconductor chip, wherein the conductor track crosses an indentation of a substrate of the semiconductor chip; and detecting the test signal at a second ends of the conductor track, which wherein the detected test signal is indicative of fracture of the substrate of the semiconductor chip at the indentation.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.