Vacuum chuck for clamping workpieces, measuring devices and method for checking workpieces, in particular wafers
US10707112B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Oct 19, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68318
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A vacuum chuck for clamping workpieces, in particular wafers, and a measuring device and a method for checking workpieces by way of X-ray fluorescent radiation. The vacuum chuck has a clamping plate having a support surface, having at least one suction connection arranged on a base body for connecting to a negative-pressure device and for clamping the workpiece on the clamping plate by negative pressure received by the base body and having several suction grooves arranged in the clamping plate and are open towards the support surface. The support surface has concentric suction grooves having a suction opening to which a negative-pressure line is connected or which is connected to a work channel. Each suction groove having a separate negative pressure, which is separate to the adjacent suction groove, is selectively controlled by a control valve by a control for supplying the respective negative pressure in the respective suction groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.