MOSFET with reduced resistance
US10707327B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Dec 28, 2015 |
| Grant date | Jul 7, 2020 |
| Priority date | — |
| Expiry date | Aug 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/257
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor substrate including a doped region. A metal layer is formed on the doped region. An insulating layer covers the metal layer. The metal layer can serve as a buried metal layer which reduces electrical resistance between electrical charge in the doped region and adjacent contacts. The contacts can extend through the insulating layer between the buried metal layer and overlying metal stripes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.