Methods and processes for forming devices from correlated electron material (CEM)

US10707415B2 · kind B2 · utility

Assignee

• Arm Limited · GB

Inventors

• Lucian Shifren · San Jose, US
• Kimberly Gay Reid · Austin, US
• Gregory Munson Yeric · Austin, US
• Manuj Rathor · Milpitas, US
• Glen Arnold Rosendale · Santa Clara, US

Key dates

• Filing date: Nov 26, 2018
• Grant date: Jul 7, 2020
• Expiry date: Nov 26, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10N70/8836
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

Subject matter disclosed herein may relate to fabrication of correlated electron materials used, for example, to perform specified application performance parameters. In embodiments, CEM devices fabricated at a first stage of a wafer fabrication process, such as a front-end-of-line stage, may differ from CEM devices fabricated at a second stage of a wafer fabrication process, such as a middle-of-line stage or a back-end-of-line stage, for example.