Composite and multilayered silver films for joining electrical and mechanical components
US10710336B2 · kind B2 · utility
1Cited by
7References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2014 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Aug 29, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12139
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Materials for die attachment such as silver sintering films may include reinforcing, modifying particles for enhanced performance. Methods for die attachment may involve the of such materials.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.