Inspection for multiple process steps in a single inspection process
US10712289B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2015 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Sep 20, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/7065
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Various embodiments for detecting defects on a wafer are provided. One method includes acquiring output generated by an inspection system for a wafer during an inspection process that is performed after at least first and second process steps have been performed on the wafer. The first and second process steps include forming first and second portions, respectively, of a design on the wafer. The first and second portions of the design are mutually exclusive in space on the wafer. The method also includes detecting defects on the wafer based on the output and determining positions of the defects with respect to the first and second portions of the design. In addition, the method includes associating different portions of the defects with the first or second process step based on the positions of the defects with respect to the first and second portions of the design.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.