Measuring complex PCB-based interconnects in a production environment
US10712398B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 21, 2017 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Jul 4, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2806
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A measuring system and method is configured to analyze numerous different types of interconnects having varying degrees of complexity. The measuring system and method characterizes an interconnect to be tested by a predefined reflection coefficient signature. Each specific interconnect is predefined by a reflection coefficient signature that is unique to that specific interconnect. Once the reflection coefficient signature is defined, a corresponding reflection envelope is defined which defines boundary limits about the reflection coefficient signature. Subsequent testing of the specific interconnect results in a measured reflection coefficient curve, which is compared to the corresponding reflection envelope. The specific interconnect under test is considered acceptable if the values of the measured reflection coefficient curve do not fall outside the reflection envelope. If one or more values of the measured reflection coefficient curve fall outside the reflection envelope, then the specific interconnect under test fails the test.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.