Packaging MEMS in fluidic environments
US10712525B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Mar 27, 2015 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method and apparatus for packaging a MEMS device is disclosed that includes a MEMS die mounting surface, a MEMS device disposed on the mounting surface, and a fluid contained within the package and surrounding at least a portion of the MEMS device. The fluid may be selected to provide certain advantageous features. For example, the fluid may have a selected index of refraction that is matched with a lens index of refraction of the lens, have a viscosity selected to provide a predetermined mechanical damping to the MEMS device, be thermally coupled with the MEMS device and configured to remove heat from the MEMS device. The fluid may also be configured in mechanical cooperation with a spring mounted scanning element, a linear translation actuator, a rotational actuator, a lens, etc. to actuate or apply fluidic pressure to such elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.