Michael Rattner
9Patents
6h-index
9Co-inventors
52Inventor score
Filing activity: May 1, 2002 → Mar 27, 2015
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6902947B2 | Integrated method for release and passivation of MEMS structures | Performing Operations; Transporting | 73 | Expired |
| US6846746B2 | Method of smoothing a trench sidewall after a deep trench silicon etch process | Performing Operations; Transporting | 16 | Expired |
| US6849554B2 | Method of etching a deep trench having a tapered profile in silicon | Electricity | 13 | Expired |
| US6830950B2 | Integrated method for release and passivation of MEMS structures | Performing Operations; Transporting | 12 | Expired |
| US7074723B2 | Method of plasma etching a deeply recessed feature in a substrate using a plasma source gas modulated etchant system | Electricity | 9 | Expired |
| US6900133B2 | Method of etching variable depth features in a crystalline substrate | Performing Operations; Transporting | 7 | Expired |
| US7618548B2 | Silicon-containing structure with deep etched features, and method of manufacture | Electricity | 4 | Active |
| US9018724B2 | Method of producing optical MEMS | Electricity | 2 | Active |
| US10712525B2 | Packaging MEMS in fluidic environments | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.