Fan-out antenna packaging structure and method making the same

US10714435B2 · kind B2 · utility

Assignee

• SJ Semiconductor (Jiangyin) Corporation · CN

Inventors

• Yenheng Chen · Jiangyin, CN
• Chengchung Lin · Jiangyin, CN
• Chengtar Wu · Jiangyin, CN
• Jangshen Lin · Jiangyin, CN

Key dates

• Filing date: Dec 4, 2018
• Grant date: Jul 14, 2020
• Expiry date: Dec 4, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/96
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

The present application provides a fan-out antenna packaging structure and a method making the same. The method comprises: providing a carrier and forming a release layer on an upper surface of the carrier; forming a chip structure on an upper surface of the release layer, the chip structure comprises an unpacked chip and a contact pad disposed on and electrically connected to the unpacked chip; forming a plastic packaging layer packaging the chip structure on the upper surface of the release layer; removing the carrier and the release layer to expose the contact pad; forming a single-layer antenna structure and forming a redistribution layer on the surface where the contact pad is disposed; forming an under-bump metal layer on an upper surface of the redistribution layer; and forming a solder ball bump on an upper surface of the under-bump metal layer.