Method of forming a semiconductor device comprising at least one germanium nanowire
US10714595B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Nov 27, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Example embodiments relate to germanium nanowire fabrication. One embodiment includes a method of forming a semiconductor device that includes at least one Ge nanowire. The method includes providing a semiconductor structure that includes at least one, the at least one fin including a stack of at least one Ge layer alternative with SiGe layers. The method also includes at least partially oxidizing the SiGe layer into SiGeOx. Further, the method includes capping the fin with a dielectric material. In addition, the method includes annealing. Still further, the method includes selectively removing the dielectric material and the SiGeOx.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.