Microphone and manufacture thereof
US10715942B2 · kind B2 · utility
0Cited by
1References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 26, 2018 |
| Grant date | Jul 14, 2020 |
| Priority date | — |
| Expiry date | Oct 31, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2231/001
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microphone and its manufacturing method are presented. The manufacturing method includes providing a substrate; forming a ring opening extending from an upper surface of the substrate into the substrate; forming a ring separation component by forming a separation material in the ring opening; forming an insulation layer on the substrate; forming a front-end device on the insulation layer; and etching a back side of the substrate using the ring separation component and the insulation layer as an etch-stop layer to form a back-hole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.