Precision alignment of the substrate coordinate system relative to the inkjet coordinate system
US10717646B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2017 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | May 5, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2201/0184
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and alignment system for minimizing errors in the deposition of films of tailored thickness. A first position on a stage is identified for optimal placement of a downward looking microscope (DLM) and an upward looking microscope (ULM) when alignment marks on the DLM and ULM are aligned, where the DLM is attached to a bridge and the ULM is attached to the stage. A second position on the stage is identified when the ULM on the stage is aligned with the alignment marks on a metrology tool. A surface of a chucked substrate affixed to the stage is then measured. A map between a substrate coordinate system and a metrology coordinate system may then be obtained using the measured surface of the chucked substrate with the first and second positions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.