Inventor · Austin, TX, US

Shrawan Singhal

18Patents
5h-index
23Co-inventors
62Inventor score

Filing activity: Feb 25, 2009 → Jun 10, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US10026609B2 Nanoshape patterning techniques that allow high-speed and low-cost fabrication of nanoshape structures Emerging Cross-Sectional Technologies 46 Active
US9415418B2 Programmable deposition of thin films of a user-defined profile with nanometer scale accuracy Performing Operations; Transporting 35 Active
US9718096B2 Programmable deposition of thin films of a user-defined profile with nanometer scale accuracy Electricity 21 Active
US9987653B2 Versatile process for precision nanoscale manufacturing Performing Operations; Transporting 20 Active
US7815824B2 Real time imprint process diagnostics for defects Performing Operations; Transporting 6 Active
US10816482B2 High throughput, high resolution optical metrology for reflective and transmissive nanophotonic devices Physics 3 Active
US8187515B2 Large area roll-to-roll imprint lithography Performing Operations; Transporting 3 Active
US10336062B2 Systems and methods for precision inkjet printing Performing Operations; Transporting 1 Active
US12009247B2 Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place Electricity 0 Active
US12094775B2 Nanoscale-aligned three-dimensional stacked integrated circuit Electricity 0 Active
US11669009B2 Roll-to-roll programmable film imprint lithography Physics 0 Active
US12168244B2 Nanoscale thin film deposition systems Physics 0 Active
US12308275B2 Heterogeneous integration of components onto compact devices using moiré based metrology and vacuum based pick-and-place Electricity 0 Active
US12424498B2 System and method for modification of substrates Performing Operations; Transporting 0 Active
US10717646B2 Precision alignment of the substrate coordinate system relative to the inkjet coordinate system Performing Operations; Transporting 0 Active
US11600525B2 Nanoscale-aligned three-dimensional stacked integrated circuit Electricity 0 Active
US11469131B2 Heterogeneous integration of components onto compact devices using moire based metrology and vacuum based pick-and-place Electricity 0 Active
US11762284B2 Wafer-scale programmable films for semiconductor planarization and for imprint lithography Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.