Microelectronic interposer for a microelectronic package
US10720407B2 · kind B2 · utility
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1References
20Claims
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Assignee
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Key dates
| Filing date | Dec 5, 2018 |
| Grant date | Jul 21, 2020 |
| Priority date | — |
| Expiry date | Dec 5, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2225/06572
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microelectronic interposer for a microelectronic package may be fabricated, wherein a first microelectronic device within the microelectronic package is in electronic communication with at least one second microelectronic device through the microelectronic interposer which positions the at least one second microelectronic device outside a periphery of the first microelectronic device. The microelectronic interposer may further include at least one recess for achieving a desired height and/or enabling various configurations for the microelectronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.