Micro-selective sintering laser systems and methods thereof

US10722947B2 · kind B2 · utility

Assignee

• The Board of Regents of the University of Texas System · US

Inventors

• Michael Cullinan · Austin, US
• Nilabh K. Roy · Austin, US
• Anil Yuksel · Yorktown Heights, US
• Chee Seng Foong · Bandar Baru Sungai Buloh, MY

Key dates

• Filing date: Mar 31, 2017
• Grant date: Jul 28, 2020
• Expiry date: Oct 16, 2038

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P10/25
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A microscale selective laser sintering (μ-SLS) that improves the minimum feature-size resolution of metal additively manufactured parts by up to two orders of magnitude, while still maintaining the throughput of traditional additive manufacturing processes. The microscale selective laser sintering includes, in some embodiments, ultra-fast lasers, a micro-mirror based optical system, nanoscale powders, and a precision spreader mechanism. The micro-SLS system is capable of achieving build rates of at least 1 cm3/hr while achieving a feature-size resolution of approximately 1 μm. In some embodiments, the exemplified systems and methods facilitate a direct write, microscale selective laser sintering μ-SLS system that is configured to write 3D metal structures having features sizes down to approximately 1 μm scale on rigid or flexible substrates. The exemplified systems and methods may operate on a variety of material including, for example, polymers, dielectrics, semiconductors, and metals.