Inventor · Bandar Baru Sungai Buloh, MY

Chee Seng Foong

37Patents
6h-index
48Co-inventors
69Inventor score

Filing activity: Oct 25, 2002 → Sep 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7285855B2 Packaged device and method of forming same Electricity 83 Active
US6900531B2 Image sensor device Electricity 30 Expired
US7554185B2 Flip chip and wire bond semiconductor package Electricity 17 Expired
US9935079B1 Laser sintered interconnections between die Electricity 12 Active
US7452750B2 Capacitor attachment method Emerging Cross-Sectional Technologies 7 Active
US8860212B1 Fluid cooled semiconductor die package Electricity 7 Active
US8049313B2 Heat spreader for semiconductor package Electricity 5 Active
US7432130B2 Method of packaging semiconductor die without lead frame or substrate Electricity 5 Active
US9040335B2 Side vented pressure sensor device Electricity 4 Active
US9209147B1 Method of forming pillar bump Electricity 3 Active
US8643172B2 Heat spreader for center gate molding Electricity 3 Active
US9202770B1 Non-homogeneous molding of packaged semiconductor devices Electricity 3 Active
US9269659B1 Interposer with overmolded vias Electricity 2 Active
US10722947B2 Micro-selective sintering laser systems and methods thereof Emerging Cross-Sectional Technologies 2 Active
US7179682B2 Packaged device and method of forming same Electricity 2 Expired
US8415779B2 Lead frame for semiconductor package Electricity 2 Active
US9997445B2 Substrate interconnections for packaged semiconductor device Electricity 1 Active
US9437492B2 Substrate for alternative semiconductor die configurations Electricity 1 Active
US7566648B2 Method of making solder pad Electricity 1 Active
US11798871B2 Device package substrate structure and method therefor Electricity 0 Active
US9209120B2 Semiconductor package with lead mounted power bar Electricity 0 Active
US10537019B1 Substrate dielectric crack prevention using interleaved metal plane Electricity 0 Active
US9134193B2 Stacked die sensor package Electricity 0 Active
US9474162B2 Circuit substrate and method of manufacturing same Electricity 0 Active
US12341089B2 Device package substrate structure and method therefor Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.