Multi-sensor tiled camera with flexible electronics for wafer inspection
US10724964B1 · kind B1 · utility
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13Claims
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Key dates
| Filing date | Apr 10, 2019 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Apr 10, 2039 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/061
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Sensor units can be disposed in a support member. Each of the sensor units can include a folded flex board having a plurality of laminations and an aperture and a sensor disposed in the folded flex board such that the sensor is positioned over the aperture. The system can be used in broad band plasma inspection tools for semiconductor wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.