Kurt Lehman
21Patents
10h-index
25Co-inventors
75Inventor score
Filing activity: Jun 25, 1993 → Apr 10, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6707540B1 | In-situ metalization monitoring using eddy current and optical measurements | Physics | 95 | Expired |
| US6433541B1 | In-situ metalization monitoring using eddy current measurements during the process for removing the film | Physics | 92 | Expired |
| US6621264B1 | In-situ metalization monitoring using eddy current measurements during the process for removing the film | Physics | 37 | Expired |
| US6628397B1 | Apparatus and methods for performing self-clearing optical measurements | Physics | 35 | Expired |
| US5552704A | Eddy current test method and apparatus for measuring conductance by determining intersection of lift-off and selected curves | Electricity | 33 | Expired |
| US8010222B2 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Performing Operations; Transporting | 18 | Active |
| US6866559B2 | Windows configurable to be coupled to a process tool or to be disposed within an opening in a polishing pad | Performing Operations; Transporting | 17 | Expired |
| US8754972B2 | Integrated multi-channel analog front end and digitizer for high speed imaging applications | Electricity | 16 | Active |
| US7070476B2 | In-situ metalization monitoring using eddy current measurements during the process for removing the film | Physics | 11 | Expired |
| US6884146B2 | Systems and methods for characterizing a polishing process | Performing Operations; Transporting | 11 | Expired |
| US6885190B2 | In-situ metalization monitoring using eddy current measurements during the process for removing the film | Physics | 9 | Expired |
| US6935922B2 | Methods and systems for generating a two-dimensional map of a characteristic at relative or absolute locations of measurement spots on a specimen during polishing | Performing Operations; Transporting | 7 | Expired |
| US7030018B2 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Performing Operations; Transporting | 6 | Expired |
| US7052369B2 | Methods and systems for detecting a presence of blobs on a specimen during a polishing process | Performing Operations; Transporting | 5 | Expired |
| US7332438B2 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Performing Operations; Transporting | 5 | Expired |
| US7175503B2 | Methods and systems for determining a characteristic of polishing within a zone on a specimen from combined output signals of an eddy current device | Performing Operations; Transporting | 5 | Expired |
| US10905613B2 | Transfer board | Human Necessities | 2 | Active |
| US9462206B2 | Integrated multi-channel analog front end and digitizer for high speed imaging applications | Electricity | 2 | Active |
| US8831767B2 | Methods and systems for monitoring a parameter of a measurement device during polishing, damage to a specimen during polishing, or a characteristic of a polishing pad or tool | Performing Operations; Transporting | 1 | Active |
| US7096752B1 | Environmental damage reduction | Electricity | 1 | Expired |
| US10724964B1 | Multi-sensor tiled camera with flexible electronics for wafer inspection | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.