High density opto-electronic interconnection configuration utilizing passive alignment
US10725254B2 · kind B2 · utility
3Cited by
11References
17Claims
0Family size
Assignee
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Key dates
| Filing date | Sep 19, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Jan 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/02345
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A high density interconnect arrangement takes the form of a backplane-pluggable card, with electrical connections formed along a single (pluggable) edge and all remaining connections provided via optical fibers. An exemplary interconnect arrangement also includes on-board optical sources and silicon photonic-based circuitry for providing optical transceiver functionality. Passively aligned fiber arrays are utilized to provide I/O connections to external elements, as well as between laser sources and on-board silicon photonics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.