Heat spreader with high heat flux and high thermal conductivity
US10727156B2 · kind B2 · utility
0Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 8, 2016 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.