Steve Qingjun Cai
10Patents
2h-index
8Co-inventors
39Inventor score
Filing activity: Jun 7, 2013 → Jun 28, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11015879B2 | Interface-free thermal management system for high power devices co-fabricated with electronic circuit | Mechanical Engineering; Lighting; Heating | 3 | Active |
| US11022383B2 | Interface-free thermal management system for high power devices co-fabricated with electronic circuit | Mechanical Engineering; Lighting; Heating | 2 | Active |
| US11406041B1 | Modular liquid cooling assembly | Electricity | 2 | Active |
| US10677536B2 | Osmotic transport system for evaporative cooling | Performing Operations; Transporting | 1 | Active |
| US11531383B1 | Mist cooling for computer systems | Electricity | 1 | Active |
| US9326383B2 | Heat spreader with high heat flux and high thermal conductivity | Emerging Cross-Sectional Technologies | 1 | Active |
| US11744037B1 | Duct arrangement for cooling server DIMM or other heat-generating components | Electricity | 0 | Active |
| US10727156B2 | Heat spreader with high heat flux and high thermal conductivity | Emerging Cross-Sectional Technologies | 0 | Active |
| US11569537B2 | Multi-functional structure for thermal management and prevention of failure propagation | Emerging Cross-Sectional Technologies | 0 | Active |
| US11482744B2 | Multi-functional structure for thermal management and prevention of failure propagation | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.