Resistive element and method of manufacturing the resistive element
US10727180B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Oct 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A resistive element includes: a semiconductor substrate; a first insulating film deposited on the semiconductor substrate; a resistive layer deposited on the first insulating film; a second insulating film deposited to cover the first insulating film and the resistive layer; a first electrode deposited on the second insulating film and electrically connected to the resistive layer; a relay wire deposited on the second insulating film without being in contact with the first electrode, and including a resistive-layer connection terminal electrically connected to the resistive layer and a substrate connection terminal connected to the semiconductor substrate with an ohmic contact; and a second electrode deposited on a bottom side of the semiconductor substrate, wherein a resistor is provided between the first electrode and the second electrode.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.