Multi-layer film device and method
US10727350B2 · kind B2 · utility
2Cited by
35References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2018 |
| Grant date | Jul 28, 2020 |
| Priority date | — |
| Expiry date | Jul 28, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D84/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.