Patent · US Active

Method for manufacturing a micromechanical inertial sensor

US10730746B2 · kind B2 · utility

0Cited by

1References

13Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Jochen Reinmuth · Reutlingen, DE
Martin Rambach · Neckartenzlingen, DE

Key dates

Filing date	Apr 26, 2018
Grant date	Aug 4, 2020
Priority date	—
Expiry date	Jan 10, 2039

Classification

Technology area (CPC G)Physics
CPC primaryG01P2015/088
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical inertial sensor, including: forming a movable MEMS structure in a MEMS wafer; connecting a cap wafer to the MEMS wafer; forming an access opening into the cavity, the access opening to the cavity being formed from two opposing sides; a defined narrow first access opening being formed from one side of the movable MEMS structure and a defined wide second access opening being formed from a surface of the MEMS wafer, the second access opening being formed to be wider in a defined manner than the first access opening; and closing the first access opening while enclosing a defined internal pressure in the cavity.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.