Martin Rambach
7Patents
1h-index
5Co-inventors
36Inventor score
Filing activity: Nov 21, 2014 → May 3, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10501311B2 | Micromechanical device having a first cavity and a second cavity | Electricity | 1 | Active |
| US10836631B2 | Method for closing off a micromechanical device by laser melting, and micromechanical device having a laser melt closure | Performing Operations; Transporting | 0 | Active |
| US10460931B2 | Semiconductor transistor having superlattice structures | Electricity | 0 | Active |
| US10730746B2 | Method for manufacturing a micromechanical inertial sensor | Physics | 0 | Active |
| US11897756B2 | Micromechanical device with contact pad | Performing Operations; Transporting | 0 | Active |
| US9761706B2 | SiC trench transistor and method for its manufacture | Electricity | 0 | Active |
| US11214482B2 | Micromechanical device including a covering bond frame | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.