Patent · US Active

Semiaromatic copolyamide resin and polyamide molding composition consisting of the same

US10731002B2 · kind B2 · utility

1Cited by

3References

10Claims

0Family size

Assignees

Inventors

Chuanhui ZHANG · Longbeilingcun, CN
Min Cao · Hsinchu, TW
Sujun JIANG · Tangxia, CN
Zhenguo Shi · Sydney, AU
Xueke Sun · Hangzhou City, CN
Liming FAN · Tangxia, CN
Mingqin Chen · Tangxia, CN
Mujun Huang · Tangxia, CN
Xianbo Huang · Tangxia, CN

Key dates

Filing date	Mar 29, 2017
Grant date	Aug 4, 2020
Priority date	—
Expiry date	Dec 30, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2201/08
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

A semiaromatic copolyamide resin and a polyamide molding composition consisting of the same are provided, consisting of following repeat units: (A) 26-80 mol % of units derived from para-amino benzoic acid; (B) 4-70 mol % of units derived from 11-aminoundecanoic acid or undecanolactam, and 0-70 mol % of units derived from another amino acids having 6 to 36 carbon atoms or units consisting of a lactam having 6-36 carbon atoms; (C) 0-37 mol % of units derived from a diamine unit having 4 to 36 carbon atoms; and (D) 0-37 mol % of units derived from a diacid unit having 6 to 36 carbon atoms; wherein, (A)+(B)+(C)+(D)=100 mol %; and molar contents of the units derived from para-amino benzoic acid and those derived from 11-aminoundecanoic acid or undecanolactam are not equal to 50 mol % simultaneously.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.