Sujun JIANG
2Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Dec 8, 2011 → Mar 29, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9051454B2 | Heat-resistant polyamide composition and application thereof | Electricity | 2 | Active |
| US10731002B2 | Semiaromatic copolyamide resin and polyamide molding composition consisting of the same | Chemistry; Metallurgy | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.