Heat pump network
US10731870B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 2016 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Dec 23, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E20/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A distributed heating network comprising a plurality of individual heat pumps. Each heat pump is individually coupled to a common heat source of the network, the common heat source of the network comprising a liquid loop within the network, the liquid of the loop being maintained at close to ambient temperature through active heat management of the common heat source. The common heat source is further coupled to at least one energy source. A controller is configure to thermally decouple the energy source from the heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.