System and method for minimizing backside workpiece damage
US10732615B2 · kind B2 · utility
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3References
18Claims
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Key dates
| Filing date | Oct 30, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Nov 7, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/49127
- WIPO fieldControl
- WIPO sectorInstruments
Abstract
A system and method for minimizing the damage to the backside of a workpiece disposed on a platen during thermal transitions is disclosed. The system includes a controller that modulates the clamping voltage and backside gas pressure during the thermal transition. By modulating the clamping voltage, the workpiece may not be as tightly held to the platen at certain times, thus minimizing damage that may be caused by particles resident on the top surface of the platen. Furthermore, the modulation of the backside gas pressure still permits good thermal conductivity between the platen and the workpiece.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.