Wafer inspection apparatus and wafer inspection method using the same
US10733719B2 · kind B2 · utility
0Cited by
6References
3Claims
0Family size
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Key dates
| Filing date | Mar 23, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Feb 8, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30148
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wafer inspection apparatus includes a linear stage configured to support a chuck on which a wafer is disposed and to move the chuck along a guide rail, wherein the guide rail extends in a first direction, an image sensor module overlapping the linear stage, and a rotary stage supported by the linear stage. The rotary stage is configured to rotate the chuck in a state where a center of the wafer is aligned with the image sensor module. The image sensor module includes a light source directing light onto the wafer, and an image sensor extending in a second direction crossing the first direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.