Semiconductor device including optically connected wafer stack
US10734354B2 · kind B2 · utility
0Cited by
7References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 27, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Apr 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04B10/27
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including a stack of wafers having a densely configured 3D array of memory die. The memory die on each wafer may be arranged in clusters, with each cluster including an optical module providing an optical interconnection for the transfer of data to and from each cluster.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.