Shineng Ma
6Patents
1h-index
15Co-inventors
37Inventor score
Filing activity: Feb 27, 2018 → Feb 26, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11177239B2 | Semiconductor device including control switches to reduce pin capacitance | Electricity | 1 | Active |
| US11276669B2 | High capacity semiconductor device including bifurcated memory module | Electricity | 1 | Active |
| US11508644B2 | Semiconductor device package having thermally conductive pathways | Electricity | 0 | Active |
| US11425817B2 | Side contact pads for high-speed memory card | Electricity | 0 | Active |
| US10734354B2 | Semiconductor device including optically connected wafer stack | Electricity | 0 | Active |
| US11355485B2 | Semiconductor die and semiconductor package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.