Patent · US Active

Methods of forming package structures for enhanced memory capacity and structures formed thereby

US10734393B2 · kind B2 · utility

0Cited by
3References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 7, 2018
Grant dateAug 4, 2020
Priority date—
Expiry dateNov 7, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/17181
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

Methods of forming microelectronic package structures, and structures formed thereby, are described. Those methods/structures may include attaching a die on a board,

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.