Light-emitting device and manufacturing method thereof
US10734557B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Dec 26, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Dec 26, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
Abstract
A light-emitting device includes a package structure and a light-emitting chip. The package structure has a light exiting surface, a rear surface facing away from the light exiting surface, a groove inward recessed on the rear surface, and an outer surrounding side wall surrounding the groove. The light-emitting chip is disposed in the groove. The width of the package structure gradually decreases from the light exiting surface to the rear surface. The width of the groove gradually increases from inside to outside of the groove.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.