Wen Lee
9Patents
3h-index
15Co-inventors
50Inventor score
Filing activity: Jun 7, 2005 → May 7, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10396252B2 | LED package structure with multiple color temperatures and method for manufacturing the same | Electricity | 9 | Active |
| US7067848B1 | High intensity LED | Electricity | 9 | Expired |
| US8836655B2 | Mobile device with supporting structures for display | Electricity | 6 | Active |
| US8823677B2 | Touch panel and method of manufacturing the same | Physics | 1 | Active |
| US10816176B1 | Light source package structure | Mechanical Engineering; Lighting; Heating | 1 | Active |
| US10522725B2 | LED structure and light-emitting unit | Electricity | 0 | Active |
| US10734557B2 | Light-emitting device and manufacturing method thereof | Electricity | 0 | Active |
| US11289880B2 | Light source package structure | Electricity | 0 | Active |
| US11205731B2 | Light source package structure | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.