MEMS packaging
US10735868B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2018 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Nov 2, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package for a MEMS device, the package comprising a MEMS transducer within a chamber of the package; and a package substrate, wherein an upper surface of the package substrate defines at least part of a surface of the chamber; wherein the package substrate comprises a plurality of metal layers, the package substrate further comprising at least a part of a filter circuit for filtering RF signals, wherein a first metal layer is provided in a first plane of the substrate and wherein a resistor of the filter circuit is provided in a plane below the first plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.