Substrates for stretchable electronics and method of manufacture
US10736212B2 · kind B2 · utility
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3References
6Claims
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Key dates
| Filing date | Sep 7, 2017 |
| Grant date | Aug 4, 2020 |
| Priority date | — |
| Expiry date | Apr 17, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K77/111
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bulk substrate for stretchable electronics. The bulk substrate is manufactured with a process that forms a soft-elastic region of the bulk substrate. The soft-elastic region includes a strain capacity of greater than or equal to 25% and a first Young's modulus below 10% of a maximum local modulus of the bulk substrate. The process also forms a stiff-elastic region of the bulk substrate. The stiff-elastic region includes a strain capacity of less than or equal to 5% and a second Young's modulus greater than 10% of the maximum local modulus of the bulk substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.