Alignment mark, imprinting method, and manufacturing method of semiconductor device
US10739676B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 12, 2019 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Mar 12, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/5446
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In an alignment mark of an embodiment, a first pattern has a periodic structure in a first direction on a surface of an original or a surface of a substrate and extends in a second direction, and a second pattern has a periodic structure in a third direction on the surface of the original or the surface of the substrate and extends in a fourth direction. The first direction and the third direction are parallel to each other. A period in the first direction of the periodic structure of the first pattern is equal to a period in the third direction of the periodic structure of the second pattern. At least one of the first pattern and the second pattern has a periodic structure in a fifth direction orthogonal to the first direction and the third direction on the surface of the original or the surface of the substrate. At least one of the second direction and the fourth direction is oblique with respect to the fifth direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.