Co-packaged die on leadframe with common contact
US10741479B2 · kind B2 · utility
0Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 3, 2020 |
| Grant date | Aug 11, 2020 |
| Priority date | — |
| Expiry date | Jan 3, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe includes a common contact. A first transistor is disposed over the leadframe with a first interconnect structure of the first transistor disposed over the common contact. A second transistor is disposed over the leadframe with a second interconnect structure of the second transistor disposed over the common contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.